Galvanic Corrosion Inhibitor
An etchant excellent at inhibiting galvanic corrosion on substrates where metals with different
potentials
(such as copper and gold) coexist, and at removing copper oxide films as well as organic/inorganic
contaminants
such as resist residues.
| Item | Features |
|---|---|
| Component Type | Hydrogen Peroxide–Sulfuric Acid based |
| OSP Process Applicability | Optimized OSP pre-treatment for PCB substrates where copper and gold coexist |
| Prevention of Excessive Copper Etching | Selective protection minimizes over-etching of copper surfaces connected to gold |
| Etch Rate | Easier process operation due to manageable, lower etch rate than conventional products |
| Copper Surface Roughness | Forms copper surface roughness suitable for OSP treatment |
| Solderability | Enables excellent solderability |
| Contaminant Removal | Excellent removal of organic/inorganic contaminants such as copper oxide films and resist residues |
Functional organic compounds protect the copper surface to suppress oxidation and form an appropriate surface roughness.
