Etching Additive
A next-generation etching additive that delivers both ultra-fine pattern precision and stable etching performance for thick copper (Cu).
| Item | Before |
|---|---|
| Etching Factor | ≤ 5 / Limited circuit precision |
| Fine Circuit Patternability | Rounding and pattern non-uniformity may occur |
| Applicable Cu Thickness Range | Pattern uniformity may decrease at certain thicknesses |
| Solution Flow Characteristics | Risk of pattern loss due to low fluidity |
| Uniformity | Uniformity degradation due to delayed solution diffusion |
| Impedance Impact | May limit high-speed signal transmission |
| After (EF-MAX) |
|---|
| ≥ 50 / Advantageous for precision circuit fabrication |
| Pattern formation optimized for fine pitch |
| Stable quality across all thickness ranges |
| Minimized pattern loss with excellent fluidity |
| Excellent liquid distribution uniformity via high-performance wetting |
| Impedance reduced by ≥ 5%, easy to reflect in design |
Mechanism
EF - MAX MECHANISM
Etching additive adsorbs onto the Cu surface
An inhibition layer forms through additive adsorption
Bottom inhibition layer is broken by spray pressure
| Etching Additive | ||
| Forms an inhibitor layer adsorbed on the surface to suppress side etching, preventing unnecessary undercut. |
EF - MAX EVALUATION
Fine pitch / Cu Thickness : 17 ㎛
Line / Space / Pitch : 30 ㎛ / 35 ㎛ / 65 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 2.04 | 2.14 | 2.73 | 2.65 |
|---|---|---|---|---|
| EF-MAX (After) |
 |
 |
 |
 |
| Etch Factor | 63.47 | ∞ | 63.47 | 95.14 |
Fine pitch / Cu Thickness : 20 ㎛
Line / Space / Pitch : 25 ㎛ / 35 ㎛ / 60 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 2.19 | 2.37 | 2.59 | 2.29 |
|---|---|---|---|---|
| EF-MAX (After) |
 |
 |
 |
 |
| Etch Factor | ∞ | ∞ | 58.25 | ∞ |
Fine pitch / Cu Thickness : 25 ㎛
Line / Space / Pitch : 37 ㎛ / 45 ㎛ / 82 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 3.50 | 3.63 | 3.45 | 3.49 |
|---|---|---|---|---|
| EF-MAX (After) |
 |
 |
 |
 |
| Etch Factor | ∞ | ∞ | 54.95 | ∞ |
Fine pitch / Cu Thickness : 35 ㎛
Line / Space / Pitch : 50 ㎛ / 50 ㎛ / 100 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 5.43 | 5.52 | 4.71 | 3.92 |
|---|---|---|---|---|
| EF-MAX (After) |
 |
 |
 |
 |
| Etch Factor | ∞ | ∞ | ∞ | ∞ |
Fine / Cu Thickness : 50 ㎛
Line / Space / Pitch : 50 ㎛ / 50 ㎛ / 100 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 10.73 | 10.49 | 10.46 | 11.12 |
|---|---|---|---|---|
| EF-MAX (After) |
 |
 |
 |
 |
| Etch Factor | ∞ | ∞ | ∞ | ∞ |
Fine / Cu Thickness : 65 ㎛
Line / Space / Pitch : 50 ㎛ / 50 ㎛ / 100 ㎛
| Fresh (Before) |
 |
 |
 |
 |
| Etch Factor | 6.00 | 5.36 | 5.56 | 5.67 |
|---|---|---|---|---|
| EF-MAX (After) |
|
|
|
|
| Etch Factor | 45.97 | 62.46 | 86.24 | 42.80 |
Technical Inquiry & Consultation
For product-related inquiries, please contact the person in charge below.Sales Department
sales@hwabaek.co.kr
