Chlorate Overview
A chlorate oxidizer that enables fast and stable etching by containing etching acceleration components
and complexing-agent components.
It can stably maintain the oxidizer concentration and keep the ORP value steady.
| Item | Details |
|---|---|
| Applicable Process | Pattern, Copper (Cu) etching process (CuCl₂ copper chloride etchant) |
| Product Form | Liquid additive |
| Applicable Lines | Tenting process: HDI, Package, MLB, FPC, RF-PCB |
| Component | Role |
|---|---|
| Sodium Chlorate (NaClO₃) | Maintains the oxidizing power of the etchant and serves as a regenerating agent |
| Hydrogen Peroxide (H₂O₂) |
Chlorate Evaluation Results
Etching Speed Comparison (vs. H₂O₂)
When the HCl value is the same, NaClO3 chlorate secures a faster etching speed than the peroxide type.
Etching Condition
| SG : 1.270 ~ 1.280 | Pressure : 1.25~1.30 kgf/㎠ | Temp : 48 ~ 49℃ | Specimen : L/S=75/75㎛ (1 oz. =35㎛) |
| HCL Conc. (N) |
Etch Rate Vs Oxidizer |
SPEED UP (%) | |
|---|---|---|---|
| H₂O₂ | NaClO₃ | ||
| 1.5 | 0.57 | 0.71 | 24 |
| 2.0 | 0.63 | 0.82 | 30 |
| 2.5 | 0.72 | 0.86 | 20 |
| 3.0 | 0.76 | 0.93 | 20 |
| 3.5 | 0.86 | 0.95 | 10 |
H₂O₂ Type vs NaClO₃ Oxidizer Etching Speed
| Category | H2O2 | NACLO3 | H₂O₂ | NACLO₃ |
|---|---|---|---|---|
| #1 | #2 | |||
 |
 |
 |
 |
|
| S.G | 1.270 | 1.270 | 1.275 | 1.275 |
| HCL | 2.5N | 1.5N | 3.5N | 2.5N |
| ORP | 560 ~ 650 mV | 560 ~ 580 mV | 560 ~ 600 mV | 560 ~ 600 mV |
| Etching Depth | 21.55 ㎛ | 21.26 ㎛ | 25.86 ㎛ | 25.86 ㎛ |
| E/R | 0.72 ㎛/sec | 0.71 ㎛/sec | 0.86 ㎛/sec | 0.86 ㎛/sec |
