HTE-100
Product : HTE-100
Sputtered Ti Layer Etch Chemical for WLCSP (Thk. : 50~150nm)
Thickness Range
(Thk. : 50~150nm)
Eco-friendly (F-free)
Process Applicable
Metal Damage Free
(SnAg, Ni, Au, Al, Cu)
Enables Finer, More Precise
Patterns than Competitors
Excellent
Process Capacity
| Product | Evaluation Item | WLCSP RDL |
|---|---|---|
| Competitor | E/R (nm/sec) | 2.0 |
| Undercut (nm) | 298.8 (O/E : 300%) | |
| HTE-100 | E/R (nm/sec) | 2.2 |
| Undercut (nm) | 265.6 (O/E : 300%) |
Mechanism
Oxidation of the titanium surface by hydrogen peroxide
Base dissolves and removes the oxidized titanium layer
Complexing agents stabilize the dissolved titanium ions
| Capacity | 1 Sheet (300% over etch) |
100 Sheets (300% over etch) |
200 Sheets (300% over etch) |
300 Sheets (300% over etch) |
|---|---|---|---|---|
| Competitor Undercut |
 |
 |
 |
 |
| 298.8 nm | 290.5 nm | 282.2 nm | 261.5 nm | |
| HTE-100 Undercut |
 |
 |
 |
 |
| 265.6 nm | 257.3 nm | 253.2 nm | 249.0 nm | |
| Ti Residue |
 |
 |
 |
 |
| No Residue | ||||
Comparison of E/R and Undercut by Processing Capacity
