HBE-500
Product : HBE-500
Eco-friendly Hybrid Wet Etchant for WLCSP that uniformly removes sputtered Cu & Ti layers simultaneously.
| Item | Details |
|---|---|
| Performance |
Eco-friendly chemical (F-free) Metal damage free (SnAg, Ni, Au, Al, etc.) Enables fine & precise patterns comparable to separate Cu/Ti etching processes Excellent process capacity |
| Form | Applicable as a 1-part or 2-part solution |
| Applications | WLCSP, MEMS processes, etc. |
Process
Conventional Process
Hybrid Process
Process
Conventional Process
Hybrid Process
Line Side Loss (Plated Cu Pattern)
| Before Etch | Just Etch | 100% Over Etch | 200% Over Etch | |
|---|---|---|---|---|
| Top View |
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| Cross Section |
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| 26.2㎛ | 26.2㎛ | 25.3㎛ (-3.4%) | 24.5㎛ (-6.5%) |
Process Capacity
| TEST | Sheet Processing Evaluation | ||||
|---|---|---|---|---|---|
| PTW (RDL) | 1 Sheet | 100 Sheets | 150 Sheets | 200 Sheets | 250 Sheets |
| E/R (nm/sec) | 2.3 | 2.3 | 2.2 | 2.2 | 2.2 |
| Undercut (nm) | 373.9 | 254.4 | 185.0 | - | - |
E/R & Undercut by Processing Capacity
| 1 Sheet | 100 Sheets | 150 Sheets | 200 Sheets | 250 Sheets | |
|---|---|---|---|---|---|
| Surface |  |
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| Undercut (nm) |
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| 373.9 | 254.4 | 185.0 | - | 100% Over etch |
