HTS-300C
Sulfuric Acid / Peroxide Based
Single-Solution Copper Etchant
Sulfuric acid and hydrogen peroxide based single-solution etchant
Provides uniform etching performance for copper and copper alloy materials
A product concentrated 4 times higher than general usage concentration.
Concentration can be adjusted according to the required etching rate (process line)
Applicable to copper etching for graphene manufacturing.
| Component | Content | Characteristics |
|---|---|---|
| Hydrogen Peroxide | 6% | Oxidation of copper material |
| Sulfuric Acid | 20% | Copper dissolution |
| Others | Includes hydrogen peroxide stabilizers, chelating agents, etching uniformity agents, etc. |
Differences in Copper Foil Materials
RA Copper Foil Manufacturing Process
ED Copper Foil Manufacturing Process
Copper Foil Etching Results for Graphene Manufacturing
| Before | After |
|---|---|
Non-uniform copper etching and graphene damage occur when using general etchants |
When HTS-300C is applied, uniform copper foil etching minimizes graphene damage |
